The Taiwan Semiconductor Manufacturing Company (TSMC) has started pilot production of its third-generation 3-nanometer semiconductor manufacturing node. Digitimes, a Taiwanese publication, provided this information. In the early stages of their lifecycle, TSMC’s manufacturing technologies frequently have limited capacity, allowing only a few companies to procure products manufactured by them. According to reports, executives from the US chipmaker Intel Corporation will visit Taiwan later this month to finalize orders for the 3nm process.
According to the report, TSMC’s initial 3nm production capacity will be limited to 40,000 wafers per month. The 3nm pilot production report comes as TSMC and Korean chaebol Samsung Group’s semiconductor manufacturing arm Samsung Foundry are neck and neck in terms of estimated mass production timelines for next-generation semiconductor manufacturing technologies. While Samsung anticipates that its intel 3nm CPU deal process will be ready in the first half of next year, TSMC CEO Dr. C.C. Wei has stated that his company will begin mass production in H2 2022.
Earlier this year, Dr. Wei’s estimates from an investor call were met by TSMC’s 3nm pilot production kickoff. It has shrinking transistor sizes. Despite TSMC’s claim that it is on track to double its process technology performance every two years, Chip fabricators are taking years to develop new technologies. In general, the freshest silicon off the Taiwanese company’s manufacturing lines is thought to go to Cupertino tech behemoth Apple, Inc, which then uses it to maintain its technological advantages in smartphones and notebooks. His company is marketing the manufacturing technology as its most advanced to date, and he believes it will pay dividends for years to come.
There have previously been reports of companies approaching TSMC for top positions in its latest chip technologies, including Santa Clara semiconductor designer Advanced Micro Devices, Inc. (AMD). Qualcomm Incorporated, based in San Diego, prefers Samsung’s 3nm chipset over its Taiwanese counterpart. More intriguingly, Digitimes believes Intel will discuss collaboration with TSMC for the 2nm process, which is significant given that the Santa Clara, California-based company is also planning its own 2nm node. According to Intel’s roadmap, which was released in July of this year, this technology, dubbed 20A (angstrom), could hit the manufacturing line in 2024.
If Dr. Wei’s estimates are correct, this could be a full year ahead of TSMC’s 2nm node, which is expected to go into production in 2025.
Intel’s 3nm process collaboration with TSMC has been reported since January 2021. It also includes the most recent report, which stated that the two would work together on a graphics processing unit (GPU) and three datacenter central processing units (CPUs). Both are critical products for intel CPU, which is still trying to establish itself in the rapidly expanding GPU market and competes with AMD in the data center segment. AMD has consistently demonstrated strong sequential and annual revenue growth https://www.sxiphone.com
If Dr. Wein’s estimates are correct, this could be a full year ahead of TSMC’s 2nm node, which could go into production in 2025. Intel’s collaboration with TSMC on 3nm process technology has been reported since January 2021. The most recent report indicates the pair working on one graphics processing unit (GPU) and three data center central processing units (CPUs). Both are significant products for Intel, which has yet to establish itself in the rapidly expanding GPU market and competes with AMD in the data center segment, where the latter continues to show strong sequential and annual revenue growth.